| 【職務編號】 |
DD21104 |
| 【職務類別】 |
IC封裝主管 |
| 【職務說明】 |
1.半導體產業工作資歷主管5年,主任工程師以上
2.熟悉半導體封裝製程
1. Responsible for developing new package/module process and technology at new products
2. Responsible for driving design rule for die, package and module shrink,Responsible for developing new materials to SiP
3. Responsible for handling and implement new products into mass production,building up all new technology, package development document
4. Responsible for 3D package application and electrical analysis
5. Responsible for reliability test and conducting failure analysis,Responsible for generate papers and patents
6. Responsible for verifying, diagnosing, indentifying and characterizing structure design in a new package
7. Analysis of resource costs and market needs, to assess project feasibility
8. Development of guidance, equipment installation, testing and standards
9. Will provide key performance indicators; assignment, instruction, assessment of its various cadres and staff, and supervise the work performance of employees.
|
| 【職務分類】 |
高階人才 |
| 【工作性質】 |
全職 |
| 【接受身份類別】 |
上班族 |
| 【詳細工作地址】 |
新竹市 |
| 【工作待遇】 |
面議 |
| 【可上班日期】 |
一個月內 |
| 【上班時段】 |
08:00-17:00 |
| 【休假制度】 |
依公司規定 |
|
