【職務編號】 |
DA11106 |
【職務類別】 |
機械設計主管 |
【職務說明】 |
Thermal Department Leader
1
Linda
台北
[工作內容]
Ø 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak)
Ø Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products.
Ø Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design.
Ø Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs.
Ø Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications.
Ø Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions.
Ø Develop, review and edit project reports, and report to customers.
Ø Assist with developing proposals and new business leads.
Ø Maintain and grow existing customer contact and relations.
[工作能力需求]
Ø Extensive knowledge about heat transfer and energy conversion system is a must.
Ø Ability to independently learn new engineering analysis tools and apply them into projects.
Ø Previous research and development experience is preferred.
Ø Software developing experience is requested, but not required. |
【職務分類】 |
高階人才 |
【工作性質】 |
全職 |
【接受身份類別】 |
上班族 |
【詳細工作地址】 |
台北市 |
【工作待遇】 |
面議 |
【可上班日期】 |
不限 |
【上班時段】 |
08:00-17:00 |
【休假制度】 |
依公司規定 |
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